Aluminum Nitride Substrates

Aluminum Nitride Substrates

Product

Alumina Ceramics-T
Alumina Ceramics

Alumina Ceramic Tube

Alumina Ceramic Rod

Alumina Ceramic Substrates

Alumina Ceramic Disc

Alumina Ceramic Plate

Alumina Ceramic Roller

Alumina Ceramic Crucible

Alumina Ceramic Ring

Alumina Ceramic Part

Silicon Carbide Ceramics

RBSiC

SSiC

R-SiC

Aluminum Nitride Ceramics

Aluminum Nitride Substrates

Aluminum Nitride Tube

Aluminum Nitride Plate

Aluminum Nitride Disc

Aluminum Nitride Part

Boron Nitride Ceramics (BN)

Boron Nitride Tube

Boron Nitride Plate

Boron Nitride Ring

Boron Nitride Nozzle

Boron Nitride Crucible

Boron Nitride Part

Aluminum Nitride Substrates

Aluminum nitride substrates are ceramic substrates made of aluminum nitride (AlN), a material with excellent thermal conductivity and electrical insulation properties. They are used in various electronic applications where high heat dissipation and high electrical insulation are required.

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Product Description

Features & Benefits

  • High thermal conductivity
  • High electrical insulation
  • Low coefficient of thermal expansion
  • High strength and hardness
  • Corrosion resistance
  • Good chemical stability
  • Efficient heat dissipation
  • Reduced device size and weight
  • Improved device performance and reliability
  • Extended device lifespan
  • Reduced maintenance and replacement costs

Markets & Applications

  • Power electronics
  • LED lighting
  • RF and microwave devices
  • Automotive electronics
  • Aerospace and defense
  • Medical devices
  • Power modules
  • LED packages
  • RF components
  • Microelectronic circuits
  • Sensors and detectors
  • Heat sinks and spreaders
  • Substrates for electronic components
Property Index of ALN  Aluminum Nitride ceramics
Property Sort Characteristic Unit AN170 AN200 AN220
Basic Properties Appearance/color Gray Gray Beige
Water absorption % 0 0 0
Volume density g/cm3 ≥3.30 ≥3.30 ≥3.26
Surface roughness Ra μm 0.1~0.6 0.1~0.6 0.1~0.6
Camber (length ‰) ≤2‰ ≤2‰ ≤2‰
Thermal Properties Thermal conductivity  (20-30℃) W/m.k ≥170 ≥200 ≥220
Coefficient of
Thermal expansivity (20℃~300℃)
×10-6/℃ 4.4 4.6 4.5
Coefficient of
Thermal expansivity(40℃~800℃)
×10-6/℃ 5.2 5.2 5.2
Mechanical Properties Flexural/Bending strength MPa ≥420 ≥300 ≥200
Modulus of elasticity GPa 320 310 310
Moh''s hardness - 8 8 8
Electrical properties Dielectric constant  (1MHz 25℃) - 8.9 8.6 8.5
(1MHz 25℃) Dielectric loss ×10-4 2.8 2 2
Dielectric strength KV/mm ≥17 ≥16 ≥15
Volume resistivity Ω.cm ≥1014 ≥1014 ≥1013

 

Regular specification of AlN  Aluminum Nitride substrates/plate and Aluminum Nitride wafer
Thickness(mm) L*W( mm)
0.381

2″* 2″                            50.8mm*50.8mm

3″*3″                         76.2mm*76.2mm 4″* 4″           101.6mm*101.6mm 4.5″* 4.5″         114.3mm*114.3mm 127*127mm
138*190mm
0.5
0.635
1
1.5
Thickness(mm) Diameter(mm)
1

Φ16

Φ19

Φ20

Φ26

Φ30

Φ35

Φ40

Φ45

Φ50

Φ52

Φ60 Φ75 Φ80 Φ200
1.2
1.5
2
2.5
3
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Other dimension and thickness which not listed are available upon requests.