Aluminum Nitride Plate

Product

Alumina Ceramics-T

Alumina Ceramics: Alumina Ceramic Tube

Alumina Ceramic Rod

Alumina Ceramic Substrates

Alumina Ceramic Disc

Alumina Ceramic Plate

Alumina Ceramic Roller

Alumina Ceramic Crucible

Alumina Ceramic Ring

Alumina Ceramic Part

Silicon Carbide Ceramics: RBSiC

SSiC

R-SiC

Aluminum Nitride Ceramics: Aluminum Nitride Substrates

Aluminum Nitride Tube

Aluminum Nitride Plate

Aluminum Nitride Disc

Aluminum Nitride Part

Boron Nitride Ceramics (BN): Boron Nitride Tube

Boron Nitride Plate

Boron Nitride Ring

Boron Nitride Nozzle

Boron Nitride Crucible

Boron Nitride Part

Aluminum Nitride Plate

Aluminum nitride (AlN) plate is a ceramic substrate material with high thermal conductivity and excellent electrical insulation properties. It is widely used in electronic and semiconductor industries for its ability to dissipate heat and withstand high voltages.

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Product Description

Features & Benefits

High thermal conductivity: 4-5 times higher than alumina
High electrical insulation: excellent dielectric properties
High strength and hardness: comparable to sapphire
Low coefficient of thermal expansion: close to that of silicon
Good thermal shock resistance: able to withstand rapid temperature changes

Markets & Applications

Electronic and semiconductor industries: as substrates for power modules, IC packages, and LED lighting
Aerospace and defense: as thermal management components for high-power electronics
Medical devices: as implantable electronic components due to biocompatibility and low electrical impedance
High-temperature processing industries: as crucibles and thermocouple protection tubes in furnaces and kilns.

Property Index of ALN Aluminum Nitride ceramics
Property Sort	Characteristic	Unit	AN170	AN200	AN220
Basic Properties	Appearance/color	—	Gray	Gray	Beige
	Water absorption	%	0	0	0
	Volume density	g/cm3	≥3.30	≥3.30	≥3.26
	Surface roughness Ra	μm	0.1~0.6	0.1~0.6	0.1~0.6
	Camber	(length ‰)	≤2‰	≤2‰	≤2‰
Thermal Properties	Thermal conductivity (20-30℃)	W/m.k	≥170	≥200	≥220
	Coefficient of Thermal expansivity (20℃~300℃)	×10-6/℃	4.4	4.6	4.5
	Coefficient of Thermal expansivity(40℃~800℃)	×10-6/℃	5.2	5.2	5.2
Mechanical Properties	Flexural/Bending strength	MPa	≥420	≥300	≥200
	Modulus of elasticity	GPa	320	310	310
	Moh''s hardness	-	8	8	8
Electrical properties	Dielectric constant (1MHz 25℃)	-	8.9	8.6	8.5
	(1MHz 25℃) Dielectric loss	×10^-4	2.8	2	2
	Dielectric strength	KV/mm	≥17	≥16	≥15
	Volume resistivity	Ω.cm	≥10¹⁴	≥10¹⁴	≥10¹³

Regular specification of AlN Aluminum Nitride substrates/plate and Aluminum Nitride wafer

Thickness(mm)

L*W( mm)

0.381

2″* 2″ 50.8mm*50.8mm

3″*3″ 76.2mm*76.2mm

4″* 4″ 101.6mm*101.6mm

4.5″* 4.5″ 114.3mm*114.3mm

127*127mm
138*190mm

0.5

0.635

1.5

Thickness(mm)

Diameter(mm)

Φ16

Φ19

Φ20

Φ26

Φ30

Φ35

Φ40

Φ45

Φ50

Φ52

Φ60

Φ75

Φ80

Φ200

1.2

1.5

2.5

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Other dimension and thickness which not listed are available upon requests.